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Wafer Level Fabrication of cMUT using Bonding and Interconnection Technique without TSV/TGV

Type: 
Conference
Description: 
Publisher: 
IEEE
Publication date: 
7 Dec 2022
Authors: 

Rishabh Agarwal, Rishi Sharma, Luca Maiolo, Antonio Minotti, Francesco Maita, Ravindra Mukhiya

Biblio References: 
Pages: 199-202
Origin: 
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
Link: 
https://scholar.google.it/citations

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