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Type: 
Conference
Description: 
In this work, an electromagnetic technique for imaging and spectroscopy of materials and devices, suitable for the characterization of MEMS and microelectronics configurations as a function of frequency in the microwave range, will be presented. In particular, near field measurements will be shown for the evaluation of dielectric properties of the materials and for imaging of RF devices. Perspective utilization in the evaluation of quantities having specific interest for the microelectronics and MEMS industries will be discussed, with reference to properties that can be deduced from the measured surface impedance, like the morphology and the frequency dependence of the material properties.
Publisher: 
IEEE
Publication date: 
22 May 2018
Biblio References: 
Pages: 1-4
Origin: 
2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)